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Evaluating Polymethyl Methacrylate (PMMA) and Blockboard as Enclosure
                           Materials for Ambient Stability in FDM Printing

                  Polymethyl  Methacrylate (PMMA)  is a versatile  polymer
               known for its optical clarity and mechanical properties, and ability
               to exhibit interesting thermal insulation characteristics. PMMA's
               thermal insulation  properties are primarily influenced by its
               structure, density, and the presence of additives or fillers (Mayer
               & Randel  2009).  The  thermal  conductivity  of  PMMA  can  be
               significantly altered by manipulating these factors, making it a
               material  of interest for  thermal management applications.
               However,    wood-based   materials  such   as   blockboard,
               characterised by laminated wooden core panels, present potential
               benefits due to their insulating properties and cost-effectiveness
               (Siciliano et al., 2023) . Blockboard, a type of engineered wood
               product, is widely used in furniture and interior construction due
               to its mechanical strength and dimensional stability. As a potential
               enclosure material  for 3D printing applications,  its thermal
               insulation characteristics are of interest. Structurally, blockboard
               consists of a core made from softwood strips laminated between
               layers of plywood or veneer. This layered configuration creates
               small air pockets within the board, which contributes to its ability
               to reduce heat transfer, thereby offering basic thermal insulation.

                  The thermal performance of blockboard is also influenced by
               its  density and wood  composition. Generally, lower-density
               blockboards contain more trapped air, which acts  as a natural
               insulator due to air’s low thermal conductivity. However, denser
               boards may exhibit slightly higher thermal conductivity due to the
               reduced volume of air spaces (Zhang, Li & Han, 2015). Despite
               their widespread use, comparative studies addressing the thermal
               performance of PMMA and blockboard enclosures  specifically
               for  FDM processes are limited.  This research investigates  the
               comparative performance of PMMA and blockboard enclosures
               for stabilising ambient temperatures during the FDM 3D printing
               process. The findings from this research aim to provide valuable
               insights into selecting appropriate enclosure materials to optimise
               print quality and efficiency in temperature-sensitive 3D printing
               applications.







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